Senior Package Design Engineer

We are looking for a Package Design Engineer to join our advanced silicon packaging design and simulation team and contribute to the design and delivery of high‑performance 2.5D/3D, chiplet‑based, FCBGA, SiP, wire bond and QFP/QFN packages used in industry‑leading products. The role requires strong technical depth in package layout execution, manufacturability, and cross‑domain co‑design with silicon, SI/PI, thermal, and reliability teams.

Key Responsibilities

• Perform package layout design and development for advanced packages including 2.5D/3D IC, FCBGA, SiP, and multi‑chip modules.
• Develop and maintain package CAD databases, ensuring accuracy and adherence to design guidelines, Design for Manufacturing (DFM), and Design for Assembly (DFA) requirements to ensure producibility.
• Manage end-to-end design cycle, including schematic creation, netlist import, footprint assignment, and generation of manufacturing outputs (Gerbers, drill data, fabrication/assembly drawings).
• Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures.
• Work closely with SI/PI, thermal, reliability, and DFT teams to support co‑design and optimization and participate in design reviews.
• Ensure designs comply with foundry, OSAT, and manufacturing design rules (DRC, LVS).
• Support ECO cycles, design updates, and version control throughout the project lifecycle.

Minimum Qualifications

• 6+ years of hands‑on experience in package CAD layout and development.
• Strong experience with 2.5D / 3D IC packaging, FCBGA and advanced substrate‑based packages, multi‑die and chiplet‑based designs.
• Proficiency in industry‑standard tools such as: Cadence Allegro Package Designer (APD / SiP), Siemens Xpedition / Innovator 3D IC, or equivalent.
• Experience working with advanced manufacturing design rules and interface with OSATs.
• Good understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals and High‑Speed Design concepts.
• Strong communication, presentation, and documentation skills with the ability to work effectively in a team environment.

Renesas is an embedded semiconductor solution provider driven by its Purpose,

To Make Our Lives Easier

. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and

shape the future

with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

• 6+ years of hands‑on experience in package CAD layout and development.
• Strong experience with 2.5D / 3D IC packaging, FCBGA and advanced substrate‑based packages, multi‑die and chiplet‑based designs.
• Proficiency in industry‑standard tools such as: Cadence Allegro Package Designer (APD / SiP), Siemens Xpedition / Innovator 3D IC, or equivalent.
• Experience working with advanced manufacturing design rules and interface with OSATs.
• Good understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals and High‑Speed Design concepts.
• Strong communication, presentation, and documentation skills with the ability to work effectively in a team environment.