Scan your resume against ATS criteria for this Senior Engineer - IC Package Design role at Qualcomm.
Qualcomm India Private Limited
Engineering Group, Engineering Group > Packaging Engineering
We are seeking an
to support the
across complex semiconductor product development programs.
This role emphasizes
, supporting package design efforts from
. The engineer will collaborate closely with
to ensure alignment, issue tracking, and timely delivery of package milestones.
EDA tools and automation are used primarily as
, while the core focus of this role is on
.
.
.
across package design, verification, and manufacturing activities.
with clear ownership and timelines.
for project and engineering stakeholders.
(e.g., dashboards, Gantt charts, milestone trackers, dependency maps) to provide clear visibility into execution status.
teams to ensure execution alignment.
to align design assumptions with manufacturing capabilities, process constraints, and yield considerations.
teams to support package readiness for qualification, ramp, and high‑volume manufacturing.
to track substrate development, availability, risks, and schedule alignment.
to support execution readiness, resolve blocking issues, and ensure manufacturability alignment.
.
that clearly define execution steps, handoffs, inputs, and outputs across the package design lifecycle.
describing:
that can be consistently followed across teams.
, coordinating with subject‑matter experts and tool owners as needed.
.
and incorporate them into updated process documentation and workflows.
.
.
, including:
without direct reporting authority.
.
.
Exposure to package design or EDA tools such as:
Scripting or automation experience (e.g.,
) is a plus but not required.
Minimum Qualifications:
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
If you would like more information about this role, please contact Qualcomm Careers.
How to apply for Senior Engineer - IC Package Design at Qualcomm?
Click the "Apply on Company Website" button on this page to submit your application directly on the employer's official portal.
What is the salary for this role?
Salary details will be discussed during the interview.
What experience is required?
1+ years of experience is required.
Is this position still open?
Yes, currently active and accepting applications.
Explore related active roles in design
Senior Engineer - IC Package Design
Qualcomm · Bangalore
